Study On The Interfacial Bonding Strength Of High Voltage Epoxy Resin Insulators Based On Adhesive Distribution
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In this high voltage standoff insulators, the bonding between the covered surface and high voltage epoxy is achieved by filling the covered portion with adhesive. Since the amount of adhesive filled in the head of the cylindrical non-conductive object at the bottom for bonding the non-conductive object and the pin portion is less than the amount of adhesive mentioned above, epoxy resin insulator needs to increase the load stress per unit area of the adhesive in the non-conductive object head.
