Ceramic Sand Reinforced Bonding Process For High Voltage Epoxy Resin Insulators
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To increase the bonding strength between high voltage standoff insulators, the cap-shaped portion, and the pin-shaped portion, ceramic sand is bonded to the inner and outer circumferential surfaces of the head portion high voltage epoxy, and the cap-shaped portion and the pin-shaped portion are bonded to epoxy resin insulator with adhesive. The pin-shaped portion is located on one side of the non-conductive head portion and has a large-diameter end portion with a tapered surface high voltage epoxy resin. This type of high voltage standoff is already known.
